









| RF parameters | unit | parameter | notes |
| Maximum transmission power | dBm | 9~11 | - |
| receiver sensitivity | dBm | -105~-106 | The air speed is 1.2kbps |
| Reference distance | M | 1500m | Clear and spacious, with an antenna gain of 5dBi, an antenna height of 2.5 meters, and an air speed of 1.2kbps. |
| Working frequency band | MHz | 855~925 | Support ISM frequency band |
| air rate | bps | 0.6k~500k | User programming control |
| Blocking power | dBm | 10 | The probability of burning is relatively low when used at close range |
| Electrical parameters | unit | parameter | notes |
| working voltage | V | 2.5~3.6 | ≥ 3.3V can ensure output power, and modules will permanently burn out if they exceed 3.8V. |
| Communication level | V | 3.3 | There is a risk of burning out when using 5V TTL |
| Transmission current power consumption | mA | 32 | Instantaneous power consumption |
| Receiving current power consumption | mA | 18 | - |
| operation temperature | ℃ | -20~+85 | Industrial grade |
| storage temperature | ℃ | -40~+125 | - |
| Hardware parameters | parameter | notes |
| chip | CC1101 | - |
| crystal frequency | 26MHz | 10ppm |
| Modulation Type | GFSK (Recommended) | Supports OOK, ASK, GFSK, 2-FSK, 4-FSK, and MSK |
| Interface method | Stamp hole | Distance 1.27mm |
| communication interface | SPI | 0~10Mbps |
| FIFO | 64Byte | Maximum length for a single transmission |
| Packaging method | Patch | - |
| antenna interface | Stamp hole | Characteristic impedance of approximately 50 ohms |
| size | 10*10mm | ±0.1mm |
| Net weight | 0.5g | ±0.05g |

| Pin number | Pin Name | Pin direction | Pin usage |
| 1 | VCC | input | power supply |
| 2 | GND | - | power supply |
| 3 | NC | - | - |
| 4 | NC | - | - |
| 5 | NC | - | - |
| 6 | ANT | input/output | Antenna interface, stamp hole (50 ohm characteristic impedance) |
| 7 | GND | - | power supply |
| 8 | NC | - | - |
| 9 | NC | - | - |
| 10 | NC | - | - |
| 11 | NC | - | - |
| 12 | MISO/GD01 | output | SPI data output |
| 13 | MOSI | input | SPI data input |
| 14 | CSN | input | Module chip selection pin, used to start an SPI communication |
| 15 | SCK | input | SPI clock input |
| 16 | GND |
- |
power supply |
| 17 | NC | - | - |
| 18 | GD00 | input/output | CC1101 chip pins, please refer to the official user manual of the chip for details |
| 19 | NC | - | - |
| 20 | GD02 | input/output | CC1101 chip pins, please refer to the official user manual of the chip for details |
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Product manual |
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Development testing |
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Introduction to Yibaite |
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Sales Hotline: 7x24 hour sales service hotline |
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[Contact email]: sales@cdebyte.com |
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Online submission: |
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[Contact email]:support@cdebyte.com |
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Technical application |
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| product model |
interface type | Chip Solution | Carrier frequency Hz | Transmission power dBm | Test distance in kilometers | air rate bps |
Packaging form | Product size mm | Product Features | technology manual |
sample buy |
|---|---|---|---|---|---|---|---|---|---|---|---|
| SPI | CC1101 | 855~925 | 10 | 1.5 | 0.6~500k | Patch | 10*10 | Small size, supports multiple modulation modes | |||
| SPI | CC1101 | 433M | 10 | 1.5 | 0.6~500k | Patch | 10*10 | Small size, supports multiple modulation modes | |||
| SPI | CC1101 | 868M | 10 | 1.5 | 0.6~500k | Patch | 14*26 | Small size, capable of developing low power consumption | |||
| SPI | CC1101 | 433M | 10 | 1.5 | 0.6~500k | Patch | 14*26 | Small size, capable of developing low power consumption | |||
| USB | - | - | - | - | - | - | 53*27 | E07-900M10S Development Evaluation Kit | |||
| USB | - | - | - | - | - | - | 53*27 | E07-400M10S Development Evaluation Kit | |||
| SPI | CC1101 | 868M | 10 | 1.5 | 0.6~500k | Patch | 14*20 | Small size, capable of developing low power consumption | |||
| SPI | CC1101 | 433M | 20 | 2 | 0.6~500k | Patch | 18*32 | Small size, capable of developing low power consumption | |||
| SPI | CC1101 | 433M | 10 | 1.5 | 0.6~500k | Patch | 14*20 | Small size, capable of developing low power consumption | |||
| SPI | CC1101 | 915M | 10 | 1.2 | 0.6~500k | Patch | 13*19 | Small size, capable of developing low power consumption | |||
| SPI | CC1101 | 868M | 10 | 1.0 | 0.6~500k | Patch | 13*19 | Small size, capable of developing low power consumption | |||
| SPI | CC1101 | 433M | 10 | 0.5 | 0.6~500k | Direct insertion | 15*30 | High performance, capable of developing low power consumption | |||
| SPI | CC1101 | 433M | 10 | 0.6 | 0.6~500k | Direct insertion | 15*30 | High performance, capable of developing low power consumption | |||
| SPI | CC1101 | 433M | 10 | 0.4 | 0.6~500k | Patch | 13*19 | Small size, capable of developing low power consumption |
-
E07-900MM10S
Product model: E07-900MM10S
interface type
: SPI
Chip Solution
: CC1101
Carrier frequency Hz
: 855~925
Transmission power dBm
: ten
Test distance in kilometers
: one point five
Air speed bps
-
: 0.6~500k
Packaging form
: Surface mount
Product size mm
: 10*10
Product features: Small size, supports multiple modulation modes
PDF :
buy
E07-400MM10S
Product model: E07-400MM10S
interface type
: SPI
Chip Solution
-
: CC1101
Carrier frequency Hz
: 433M
Transmission power dBm
: ten
Test distance in kilometers
: one point five
Air speed bps
: 0.6~500k
Packaging form
: Surface mount
Product size mm
: 10*10
-
Product features: Small size, supports multiple modulation modes
PDF :
buy
E07-900T10S
Product model: E07-900T10S
interface type
: SPI
Chip Solution
: CC1101
Carrier frequency Hz
: 868M
Transmission power dBm
: ten
-
Test distance in kilometers
: one point five
Air speed bps
: 0.6~500k
Packaging form
: Surface mount
Product size mm
: 14*26
Product features: Small size, can be developed with low power consumption
PDF :
buy
E07-400T10S
Product model: E07-400T10S
-
interface type
: SPI
Chip Solution
: CC1101
Carrier frequency Hz
: 433M
Transmission power dBm
: ten
Test distance in kilometers
: one point five
Air speed bps
: 0.6~500k
Packaging form
-
: Surface mount
Product size mm
: 14*26
Product features: Small size, can be developed with low power consumption
PDF :
buy
E07-900MBL-01
Product model: E07-900MBL-01
interface type
: USB
Chip Solution
:-
Carrier frequency Hz
-
:-
Transmission power dBm
:-
Test distance in kilometers
:-
Air speed bps
:-
Packaging form
:-
Product size mm
: 53*27
Product Features: E07-900M10S Development Evaluation Kit
PDF :
-
buy
E07-400MBL-01
Product model: E07-400MBL-01
interface type
: USB
Chip Solution
:-
Carrier frequency Hz
:-
Transmission power dBm
:-
Test distance in kilometers
:-
-
Air speed bps
:-
Packaging form
:-
Product size mm
: 53*27
Product Features: E07-400M10S Development Evaluation Kit
PDF :
buy
E07-900M10S
Product model: E07-900M10S
interface type
: SPI
-
Chip Solution
: CC1101
Carrier frequency Hz
: 868M
Transmission power dBm
: ten
Test distance in kilometers
: one point five
Air speed bps
: 0.6~500k
Packaging form
: Surface mount
Product size mm
-
: 14*20
Product features: Small size, can be developed with low power consumption
PDF :
buy
E07-433M20S
Product model: E07-433M20S
interface type
: SPI
Chip Solution
: CC1101
Carrier frequency Hz
: 433M
Transmission power dBm
-
: twenty
Test distance in kilometers
: two
Air speed bps
: 0.6~500k
Packaging form
: Surface mount
Product size mm
: 18*32
Product features: Small size, can be developed with low power consumption
PDF :
buy
E07-400M10S
-
Product model: E07-400M10S
interface type
: SPI
Chip Solution
: CC1101
Carrier frequency Hz
: 433M
Transmission power dBm
: ten
Test distance in kilometers
: one point five
Air speed bps
: 0.6~500k
