LED bracket plasma cleaning machine TS-VPL150 product parameters:

LED bracket plasma cleaning machine product introduction:

LED supportThe plasma cleaning machine consists of a vacuum chamber, a vacuum pump unit, a power supply, a gas supply device, and a control part (including vacuum control, power control, temperature control, gas flow control, etc.); In a vacuum state, a high-frequency alternating electric field is formed between the electrodes, and the gas in the region is excited by the alternating electric field to form plasma. The active plasma has a dual effect of physical bombardment and chemical reaction on the cleaned object, turning the surface pollutants into particles and gaseous substances, which are then evacuated to achieve the purpose of cleaning. Plasma cleaning belongs to dry cleaning, which has the advantages of good cleaning effect, easy operation (eliminating the drying process of wet cleaning), and simple waste gas treatment. It is widely used in semiconductor wafer manufacturing, semiconductor testing, semiconductor packaging, etcLEDIndustries such as packaging and vacuum electronics, connectors, and relays.

Application of plasma cleaning machine in LED packaging:

LEDThe packaging process mainly includes solidification, wire bonding, fluorescent powder coating, lens production, cutting, testing, and packaging. Plasma cleaning is required before solidification and wire bonding; Some products require plasma cleaning after being coated with fluorescent powder.

LEDThe main problems in the production process:

(1)LEDThe main problem during the production process is the difficulty in removing pollutants and oxide layers.

(2)The connection between the bracket and the colloid is not tight enough, with small gaps,After being stored for a long time, air enters and oxidizes the surface of the electrode and bracket, causing dead lamps.

solution:

(1)Before using silver glue. Contaminants on the substrate can cause the silver paste to form a spherical shape,Not conducive to chip adhesion,And it is easy to cause damage to the chip during manual piercing,The use of radio frequency plasma cleaning can greatly improve the surface roughness and hydrophilicity of workpieces,Beneficial for silver glue spreading and chip bonding,At the same time, it can greatly save the amount of silver glue used,Reduce costs.

(2)Before wire bonding. After the chip is pasted onto the substrate,After high-temperature curing,The pollutants present on it may include micro particles and oxides, etc,These pollutants cause incomplete soldering or poor adhesion between the leads, chips, and substrates through physical and chemical reactions,Causing insufficient bonding strength. Perform RF plasma cleaning before wire bonding,It will significantly enhance its surface activity,Thereby improving the bonding strength and the uniformity of the tension of the bonding wire. The pressure of the bonding blade can be lower(When there are pollutants present,The bonding head needs to penetrate pollutants,Requires significant pressure),In some cases,The bonding temperature can also be lowered,Therefore, increasing production,Reduce costs.

(3)LEDBefore sealing. existLEDDuring the process of injecting epoxy resin adhesive,Pollutants can cause a higher rate of bubble formation,This leads to low product quality and service life,so,Avoiding the formation of bubbles during the sealing process is also a concern for people. After RF plasma cleaning,Chips and substrates will be more tightly combined with colloids,The formation of bubbles will be greatly reduced,At the same time, it will significantly improve the heat dissipation rate and light emission rate.