The VAC-W series HMDSyuchuli vacuum oven is used for pre-processing chips before coating. The equipment consists of a chamber, vacuum, heating, nitrogen filling, liquid addition, and control system. By repeatedly pre vacuuming and heating with hot nitrogen at 150 º C, the surface of the silicon wafer can be dried and cleaned, while effectively preventing oxidation and impurity diffusion of the silicon wafer. Additionally, an HDMS protective film can be formed on the surface of the silicon wafer through a liquid addition system, resulting in excellent coating performance. Compared with manually coated HMDS, it has significant advantages such as good repeatability, saving medication, environmental protection, and being harmless to the human body; It can also be used for cleaning other processes of chips. The control adopts PLC, and the human-machine interface adopts touch screen, which has the characteristics of high reliability, convenient operation, and intuitive.
Standard features:

The LCC temporarily reaches an LCD temperature of 500 ° F (260 ° C). Up to 662 ° F (350 ° C)

The vacuum degree can reach 1 Torr (133Pa)

Stainless steel internal and external, all internal seams are continuously welded on the insulation side to protect the chamber from contamination

U system has a large LCD display screen, integrated data recording function and USB port, which can achieve simple oven settings and data export

Modbus communication connection for remote monitoring and recording

End of loop and high limit sound and light alarm

U Programmable door lock

Open control panel

Options:

Data collection software

Oil free vacuum pump

Automatic HMD addition device

U complies with CE standards